Hydrogen Peroxide Removal From Chemical–Mechanical Planarization Wastewater

Abstract

The goal of this paper was to identify and investigate a practical method for removing hydrogen peroxide from wastewater generated during chemical and mechanical planarization of integrated circuits. Rates of hydrogen peroxide destruction were investigated using: 1) ultraviolet (UV) light; 2) electrochemical reduction and oxidation; 3) two activated carbon catalysts; and 4) a pyrolusite catalyst. The effects of ethylenediaminetetraaceticacid (EDTA), ethylenediamine (ED), and dissolved copper ions on rates of <formula formulatype="inline" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex Notation="TeX">${\rm H}_{2}{\rm O}_{2}$</tex></formula> destruction were also investigated. Hydrogen peroxide destruction rates using UV light and the electrochemical reactor were too slow to be useful in a practical treatment scheme. Both activated carbon and pyrolusite catalysts produced fast rates of <formula formulatype="inline" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex Notation="TeX">${\rm H}_{2}{\rm O}_{2}$</tex></formula> destruction. However, the presence of EDTA and ED decreased reaction rates on activated carbon, whereas rates on pyrolusite were unaffected. Column experiments with the pyrolusite yielded greater than 99.9% <formula formulatype="inline" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex Notation="TeX">${\rm H}_{2}{\rm O}_{2}$</tex></formula> destruction using empty bed contact times as short as 1 min.