Abstract
A number of process steps that build on one another are required to manufacture optical components from glass. The polishing steps are the most time-consuming and therefore cost-intensive parts of the process chain. Low removal rates and the depth of the Sub Surface Damage (SSD) to be removed contribute to this. An alternative for the complete removal of the SSD-penetrated material using contactless polishing methods such as Ion Beam Figuring (IBF) is the healing of the SSD. Due to the induced energy during laser-polishing, the material is remelted at the defects and the SSD are closed. However, laser-polishing is also associated with disadvantages in terms of shape accuracy and surface quality. The project HyoptO is therefore devoted to the development of a hybrid-process-chain consisting of laser processing and conventional polishing. It is expected that the healing times of the SSD can significantly reduce the process times in the subsequent polishing steps. However, there are a few questions to be answered regarding the economic use of the hybrid-process-chain. These include:
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