Abstract
PurposeThe purpose of this paper is to describe the development of simulation tools dedicated to eddy current non destructive testing (ECNDT) on planar structures implying planar defects. Two integral approaches using the Green dyadic formalism are considered.Design/methodology/approachThe surface integral model (SIM) is dedicated to ideal cracks, whereas the volume integral method is adapted to general volumetric defects.FindingsThe authors observed that SIM provides satisfactory results, except in some critical transmitting/receiving (T/R) configurations. This led us to propose a hybrid method based on the combination of the two previous ones.Originality/valueThis method enables to simulate ECNDT on planar structures implying defects with a small opening using T/R probes.
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More From: COMPEL - The international journal for computation and mathematics in electrical and electronic engineering
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