Abstract
In this article we describe a novel cooling scheme utilizing a combination of fluidic (single-phase convection and phase change) and solid-state (superlattice cooler) techniques to simultaneously remove high background heat fluxes (∼100 W/cm2) over the entire chip and dissipate ultra high heat fluxes (∼0.5–1 kW/cm2) from multiple localized hot spots. This article focuses on the conceptual design to assess the feasibility of the proposed cooling scheme.
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More From: Nanoscale and Microscale Thermophysical Engineering
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