Hybrid silver pastes with synergistic effect of multi-scale silver fillers and the application in flexible circuits

Abstract

Silver circuits prepared by new hybrid pastes exhibit high electrical conductivity and mechanical properties, which are ideal for modern flexible electronics. Herein, the hybrid silver pastes composed of different silver nanoparticle content (0, 10, 20, 30 wt%), micron-sized silver flakes and epoxy-based binders were prepared. The corresponding electrical conductivity and bending resistance of the screen-printed silver circuits were studied. The experimental results demonstrated that the synergistic effect of micro-size silver flakes and nanoparticles can greatly improve the electrical conductivity and bending resistance of flexible circuits. Specifically, the silver circuits with 46 wt% micro-size silver flakes and 20 wt% silver nanoparticles incorporation exhibit a lower electrical resistivity of 8.1 × 10−5 Ω·cm. Moreover, 10 wt% silver nanoparticles can be applied to significantly reduce the resistance change of flexible circuit, indicting a superior bending property. Our designed hybrid silver pastes with excellent performance might enable valuable applications in advanced electronic devices.