Abstract

Current discrete optical solutions for high data-rate link applications, even with potentially high manufacturing volumes, are too costly. Highly integrated, multifunction modules are a key part of the solution, reducing size and cost while providing improved reliability. Silicon, with its proven manufacturability and reliability, offers a solid foundation for building a cost-efficient path to successful products. In this paper, recent work on the development of silicon photonic enabling components for multichannel high data-rate links is presented.

Highlights

  • High-speed consumer connections are becoming more prevalent due to the introduction of newer services such as online video, HDTV, IPTV, and the increase of personalized data content

  • The availability of cost-effective interface solutions operating at data rates of multiples of 10 Gbps or above over a single fiber will enable the proliferation of these new services by greatly reducing the wiring complexity, instrumentation, and operating cost in highcapacity fiber-optic networks

  • We discuss the development of components based on a silicon photonics hybrid platform that will create a compact and low-cost solution for multiple channel transmission over single mode fiber

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Summary

INTRODUCTION

High-speed consumer connections are becoming more prevalent due to the introduction of newer services such as online video, HDTV, IPTV, and the increase of personalized data content. We discuss the development of components based on a silicon photonics hybrid platform that will create a compact and low-cost solution for multiple channel transmission over single mode fiber. The refractive index of silicon is similar to that of active materials such as GaAs and InP, facilitating efficient coupling between silicon waveguides, and hybridized active devices such as lasers and photodetectors For powered devices such as lasers, the high thermal conductivity of silicon enables efficient heat removal and good equalization of temperature across a chip. Not implemented for the devices described in this paper, the Si photonics platform enables the fabrication of three dimensional tapers (Figure 3) that can significantly reduce fiber coupling loss to standard single-mode fiber. Taper structures can be used to improve coupling efficiency to hybridized optical components

SILICON MUX AND DEMUX
HYBRID INTEGRATION
Photodetector
POWER BUDGET
CONCLUSIONS
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