Hybrid orientation technology and strain engineering for ultra-high speed MOSFETs

Abstract

We report here RF MOSFET performance in sub-45-nm hybrid orientation CMOS technology. Based on the combination of hybrid orientation technology (HOT) and process-induced local strain engineering, MOSFET RF performance is investigated using CAD (TCAD) technology. Transistor optimization on (100) substrate via silicon nitride (Si 3 N 4 ) cap layer thickness for n-MOSFETs, Ge mole fraction optimization for p-MOSFETs on (110) substrates and channel length scaling have resulted in record RF performance, viz. the cut-off frequency, \({f_{\rm T}}\).