Abstract
AbstractThe combination of hybrid integration technology with guided‐wave optical technology is expected to provide more functional optical devices with high performance, compactness, and high productivity.This paper reviews recent developments in the hybrid integration of optical and electronic components with a silica‐based planar lightwave circuit on silicon. First, edge‐hybrid, surface‐hybrid, and film‐hybrid integration technologies are described. Next, basic technical issues concerning optical component integration, electronic component integration, and packaging are discussed. Emphasis is placed on optical alignment, component fixing, mode‐field matching, and antireflection techniques in the optical component integration. Finally, examples of fabricated hybrid‐integrated optical devices are presented.
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