Abstract

In this research, a hybrid simulation framework was developed for prediction of microstructural evolution during post-deformation annealing of severely deformed Sn-5Sb lead-free solder alloy. In this regard, a Monte Carlo (MC) model coupled with finite element method (FEM) was used to simulate the grain structure evolution of Sn-5Sb alloy during annealing after equal channel angular pressing (ECAP). The FEM simulation was first utilized to predict the deformation-based state variables in severely deformed Sn-5Sb samples. Then, the microstructural evolution was modeled using MC method, in which, the stored energy values (calculated from the FEM results) were implemented as model input data. After correlating the Monte Carlo simulation time with real time, kinetics of recrystallization and subsequent grain growth and also distribution of grain size were predicted. For model verification, the predicted grain size was compared with the experiments in which a reasonable agreement was obtained. It was found that, by implementing the evolution of the stored energy into the simulation, predictions acquire a reasonable agreement with experimental data.

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