Hybrid microcircuit intraconnection processes

Abstract

Hybrid intraconnections join thin film networks and applique components into an electrically functional hybrid microcircuit (HMC). Applique components were intraconnected with thermocompression (TC) bonds to chromium/gold metallized thin film networks. The project determined critical processes, material parameters, quality criteria, and characterization techniques. The program began on July 1, 1970, and initial efforts consisted of organizing the development program and forecasting needed equipment and manpower. The total time schedule was then PERT-charted. Gold beam-lead devices, gold wire, and chromium/gold films had already been selected for these intraconnection technologies. Thermocompression bonding was developed to provide intraconnections between the HMC gold conductor metallization and gold beam-lead active devices, gold plated external leads, and gold terminated applique devices, such as capacitors. An optimum combination of bonding parameters based on the fundamental physics of the process was developed. This philosophy required bonding equipment to be thoroughly characterized so that the value of bonding parameters (such as force and temperature) indicated on the bonder could be translated into measurable values of the force and temperature within the bond zone.