Hybrid integration process for the development of multisensor chips

Abstract

A novel hybrid integration process had been developed for the integration of single crystal pyroelectric detector with readout IC based on a thinning and anisotropic conduction tape bonding technique. We report our recent progress in applying the hybrid integration process for the fabrication of a multisensor chip with thermal and sound detectors integrated. The sound detector in the multisensor chip is based on thinned single crystal quartz, while the thermal detector in the chip is making use of thinned PLZT ceramic wafer. A membrane transfer process (MTP) was applied for the thinning and integration of the single crystal and ceramic wafers.