Hybrid integration of semiconductor lasers with Si-based single-mode ridge waveguides

Abstract

Hybridization is a convenient way for providing silicon-based integrated optical circuits with a laser source. An entirely passive alignment technique exclusively based on the high precision obtainable by lithography and by semiconductor processes was examined. A novel way of cleaving the laser chips by self-aligned cleaving grooves was employed. It resulted in 15.5-dB coupling losses between the laser diode and the single-mode buried ridge waveguide. >