Abstract
Using reactive DC sputtering in a gas aggregation cluster source, we show that pulsed discharge gives rise to a huge increase in deposition rate of nanoparticles by more than one order of magnitude compared to continuous operation. We suggest that this effect is caused by an equilibrium between slight target oxidation (during “time-off”) and subsequent sputtering of Ti oxides (sub-oxides) at “time-on” with high power impulse.
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