Abstract
The operation of Rapid-Single-Flux-Quantum logic (RSFQ) circuits is strongly influenced by thermal noise. Especially for higher temperatures the bit-error rate (BER) is a critical issue. A new design concept focused on improved noise immunity has been developed to reach an optimal BER for high-temperature superconductor (HTS) RSFQ cells. For example, we expect for a T-Flip-Flop (TFF) of our cell library a theoretical improvement of the BER of six orders of magnitude at a temperature of 50 K. To verify the new design approach, we have designed basic RSFQ cells using parameter values derived from our multilayer technology. The process with two superconducting YBCO layers is based on substrates with two bicrystal lines. This paper focuses on the multilayer technology to realize the optimal design parameters. One of the most crucial issues is patterning of small structures on a micron scale, especially the small vias. This new patterning process is described in detail.
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