Abstract
A two-sided no clean mass reflow process for large plastic ball grid array (PBGA) and plastic quad flat pack (PQFP) packages is presented. Emphasis is placed on the PBGA and PQFP assembly parameters such as the design, materials, and processing of the packages and printed circuit board (PCB), solder paste, stencil printing, pick-and-place, reflow, and inspection. The solder joint reliability of the two-sided PCB assembly is evaluated by shear tests and thermal cycling tests.
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