Abstract
During the past ten years, copper (Cu) bond wires have increasingly replaced gold (Au) wire materials. While this development began in the consumer electronics sector, Cu wires are now increasingly advancing into applications with challenging environmental conditions and high reliability requirements, such as the automotive sector. In the meantime, several types of high reliability Cu wires are available in the market. However, there are only few papers describing/comparing the effect of the additive element used in the Cu bulk material. Thus, we investigated the failure and improving mechanisms of Cu wire bond contacts with different type of additive elements. Subsequent to the challenging artifact-free preparation routines, high resolution analyses (SEM, transmission electron microscopy - TEM, nanospot-EDS) were carried out on ball bond contacts to clarify the effect of additive elements to the reliability of the wire bonded contacts especially during HAST. The results of this investigation will be valuable information for the wire users in selecting the optimal wire material required for automotive devices.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
