HOT EMBOSSING FOR MEMS USING SILICON TOOLS

Abstract

International Journal of Computational Engineering ScienceVol. 04, No. 03, pp. 609-612 (2003) Poster PapersNo AccessHOT EMBOSSING FOR MEMS USING SILICON TOOLSMATTHIAS KÜCHLER, THOMAS OTTO, THOMAS GESSNER, FRANK EBLING, and HENNIG SCHRÖDERMATTHIAS KÜCHLERFraunhofer Institute Reliability and Microintegration, Reichenhainer Straβe 88, D-09126 Chemnitz, Germany Search for more papers by this author , THOMAS OTTOFraunhofer Institute Reliability and Microintegration, Reichenhainer Straβe 88, D-09126 Chemnitz, Germany Search for more papers by this author , THOMAS GESSNERFraunhofer Institute Reliability and Microintegration, Reichenhainer Straβe 88, D-09126 Chemnitz, GermanyCenter of Microtechnologies at Chemnitz University of Technology Straβe 70, D-09126 Chemnitz, Germany Search for more papers by this author , FRANK EBLINGFraunhofer Institute Reliability and Microintegration, Gustav-Meyer-Allee 25, D-13335 Berlin, Germany Search for more papers by this author , and HENNIG SCHRÖDERFraunhofer Institute Reliability and Microintegration, Gustav-Meyer-Allee 25, D-13335 Berlin, Germany Search for more papers by this author https://doi.org/10.1142/S1465876303001873Cited by:4 PreviousNext AboutSectionsPDF/EPUB ToolsAdd to favoritesDownload CitationsTrack CitationsRecommend to Library ShareShare onFacebookTwitterLinked InRedditEmail AbstractThe paper deals with the development of silicon tools and an appropriate hot embossing technology for polymers. With this technology, high quality embossing of optical or fluidic structure for high precision requirements in a batch process is possible thereby reducing system costs. Possible usage is the production of Micro Electro Mechanical Systems (MEMS) for optical or fluidic applications. This could be sensors for chemical analysis of liquids or BioMEMS. Further promising applications are multifunctional printed circuit boards (PCB) or micro cooler. Up to now for coarser dimensions the use of conventional made (e.g. miling) steel tools is common. For forming of smallest structures down to the sub-micrometer range with excellent surface roughness LIGA technology is applied. However, in order to reduce the system costs LIGA tools shall be substituted by silicon tools. Deep reactive ion etching (DRIE) is used to fabricate such an embossing tools allowing complex geometrical figures. For fluidics or optical applications the tool structures have to show a tapered (positive) profile and sufficient low roughness. Roughness can be minimised by further oxidation and etch steps. The hot embossing experiments which will be presented show the capability of the optimised DRIE technology for the aimed application field.Keywords:hot embossingsilicon toolsDRIE References J. Böhm, A. Schubert, T. Otto and T. Burkhardt, "Micro-Metalforming with Silicon Dies, Proc. of 3rd Int. Conference Micro Mat 2000, Berlin, Germany (April 2000) . Google Scholar T. Otto, A. Schubert, J. Böhm and T. Gessner, Fabrication of Micro Optical Components by High Precision Embossing, Proc. of SPIE's 2000 Symposium on Micromachining and Microfabrication 4179, Santa Clara, California USA (September 2000) . Google Scholar H. Becker and U. Heim, Silicon as Tool Material for Polymer Hot Embossing, Proc. of 12th IEEE Int. Conf. on Micro Electro Mechanical Systems, Orlando, USA (1999), 228-231 . Google ScholarA. A. Ayón, R. L. Bayt and K. S. Breuer, Smart Mater. Struct. 10, 1135 (2001). Crossref, Google ScholarM. Chablozet al., Microsystem Technologies 6, 86 (2000). Crossref, Google ScholarH. Schröderet al., GMM-Fachbericht 37, 51 (2002). Google Scholar FiguresReferencesRelatedDetailsCited By 4Impact of Surface Roughness on Evaporation in 2D MicromodelsYi Ding and Helmut Geistlinger1 November 2021 | Water Resources Research, Vol. 57, No. 11Impact of Wettability and Gravity on Fluid Displacement and Trapping in Representative 2D Micromodels of Porous Media (2D Sand Analogs)Saeed Golmohammadi, Yi Ding, Matthias Kuechler, Danny Reuter and Steffen Schlueter et al.30 September 2021 | Water Resources Research, Vol. 57, No. 10Evaporation Study Based on Micromodel Experiments: Comparison of Theory and ExperimentHelmut Geistlinger, Yi Ding, Bernd Apelt, Steffen Schlüter and Matthias Küchler et al.8 August 2019 | Water Resources Research, Vol. 55, No. 8Revisiting micro hot-embossing with moulds in non-conventional materialsChantal Khan Malek, Jean-René Coudevylle, Jean-Claude Jeannot and Roland Duffait6 July 2006 | Microsystem Technologies, Vol. 13, No. 5-6 Recommended Vol. 04, No. 03 Metrics History Keywordshot embossingsilicon toolsDRIEPDF download