Abstract
The high-temperature deformation behavior of Al 7075/SiCp Composites was investigated by carrying out compression tests for determination of the optimum hot deformation conditions. The tests were carried out in the temperature range of 300 – 500 ◦C and strain rates ranging from 0.001 – 1.0 s-1 with a height reduction of 50%. The optimum hot-working conditions were decided from the processing map based on the dynamic materials model (DMM). Dynamic recrystallization (DRX) occurred over the entire temperature and strain rate range. However, uniformly sized grains were formed at the temperature range of 300 – 500 ◦C and strain rate range of 0.001– 0.01 s-1, which are the optimum condition for hot working of this material. The characteristic microstructures predicted from the processing map agreed well with the results of microstructural observations.
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