Abstract
In this study, the hot deformation of a Cu–0.55Sn–0.08La (wt.%) alloy was studied using a Gleeble-3180 testing machine at deformation temperatures of 400–700 °C and various strain rates. The stress–strain curve showed that the hot deformation behavior of the Cu–0.55Sn–0.08La (wt.%) alloy was significantly affected by work hardening, dynamic recovery, and dynamic recrystallization. The activation energy Q was 261.649 kJ·mol−1 and hot compression constitutive equation was determined as The microstructural evolution of the alloy during deformation at 400 °C revealed the presence of both slip and shear bands in the grains. At 700 °C, dynamic recrystallization grains were observed, but recrystallization was incomplete. In summary, these results provide the theoretical basis for the continuous extrusion process of alloys with promising application prospects in the future.
Highlights
Introduction opper alloys arestructuCroapl panerdaflulonycstioanrealstmruactteuriraallsawndithfuenxccteilolnenatl meleactetrriicaalls awnidthmeexcchelalnenictael lectrical and mechanical ies
When the strain rate increased rapidly, the plastic deformation occurred in a short time, the deformed grains could not recover or recrystallize in time, the work hardening effect was significant, the dislocation density in the alloy increased, and the flow stress peak value increased significantly
The following conclusions were drawn: 1. The flow stress of the Cu–0.55Sn–0.08La alloy decreased with the deformation temperature and increased with strain rate
Summary
For strain rates exceeding the critical value (1 s−1), the peak of flow stress increased significantly. When the strain rate increased rapidly, the plastic deformation occurred in a short time, the deformed grains could not recover or recrystallize in time, the work hardening effect was significant, the dislocation density in the alloy increased, and the flow stress peak value increased significantly. With the increase of strain rate from 0.01 to 0.05 s−1 at 500 ◦C, the peak value of flow stress increased rapidly and tended to stabilize from 0.1 to 1 s−1. At strain rates exceeding 1 s−1, the peak value of the flow stress enhanced significantly. Athsestdriasilnocraatitoenindcisrteraibsuedtio, nat wMaatseroiablss2e0r2v0,e1d3,fixrFsOt RtoPbEEeRuRnEeVvIeEnWand gradually evolved into an independent cellular struct5uroef i1n2 different dislocation tangled areas [21] This led to the formation of dislocation cells and reduction 3in.2d. This led to very high dislocation density in the sub-structure, a very small structure of the sub crystal, and many dislocation tangles in the cell wall
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