Abstract
Epoxy mold compound (EMC) has been widely applied as the packaging material in the electronic industry. It is due to the unique property of EMC such as high temperature stability, low coefficient of thermal expansion (CTE), excellent electrical properties and manufacturability. Despite of superior properties of EMC, several failures have been reported regarding on the electronic packaging application such as crack on the body (EMC). Most of the research reported that the crack defect was originated from the moisture absorption. This research is intended to examine the phenomenon and effect of moisture absorption on the vertical and horizontal crack formation. A comparison between control and conditioned sample was studied where the conditioned sample was subjected to humidity chamber according to the Moisture Sensitivity Level 3 (MSL3) requirement. Horizontal crack occurrence has been observed at the interface EMC. While vertical crack occurrence could be linked with the horizontal crack. Further analysis suggest that horizontal crack occurrence induced vertical crack occurrence. Thus, controlling moisture absorption pathway probably minimize horizontal crack and prohibit vertical crack occurrence.
Highlights
Epoxy mold compound (EMC) is widely used as encapsulation materials in electronic packaging industry due to their excellent electrical properties and manufacturability
The crack can be observed at high temperatures during the reflow process if the concentration of moisture within the EMC exceeds the critical value which occurs as an interfacial delamination
The moisture content of the components increased linearly with time. This behavior indicated that EMC use this study was able to absorb moisture as typical hermetic package from the epoxy based polymeric material
Summary
Epoxy mold compound (EMC) is widely used as encapsulation materials in electronic packaging industry due to their excellent electrical properties and manufacturability. At high temperature especially during the reflow process in the solder mount assembly (SMA), the absorbed moisture is rapidly vaporized and tend to exhibit ‘pop-corning’ issue [1]-[3]. The crack can be observed at high temperatures during the reflow process if the concentration of moisture within the EMC exceeds the critical value which occurs as an interfacial delamination. The moisture that presents in the mold compound will vaporize during high temperature and stress the package. This stress induces the package to crack, which causes delamination between the mold compound and lead frame or die. Most of the research on the crack formation of EMC was focused on investigating the moisture absorption, vaporization, and delamination deformation (loss of adhesion).
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
