Abstract

An optically interconnected multichip module designed specifically to meet the demands of high performance processor array systems is proposed. The system consists of computer generated holograms GaAs laser array chips and Si VLSI chips containing processing elements and integrated photodetectors. All components are incorporated into a package (similar to an existing multichip module design) with a water-cooled heat sink. All intramodule chip-to-chip connections longer than a particular line length and all intermodule connections are implemented optically. Limitations on power dissipation bandwidth connection density and alignment tolerances are discussed. The performance is compared with both electrical thin film interconnects and guided wave optical interconnects.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.