Abstract
2D materials with atomically thin nature are promising to develop scaled transistors and enable the extreme miniaturization of electronic components. However, batch manufacturing of top-gate 2D transistors remains a challenge since gate dielectrics or gate electrodes transferred from 2D material easily peel away as gate pitch decreases to the nanometer scale during lift-off processes. In this study, an oxidation-assisted etching technique is developed for batch manufacturing of nanopatterned high-κ/metal gate (HKMG) stacks on 2D materials. This strategy produces nano-pitch self-oxidized Al2O3/Al patterns with a resolution of 150nm on 2D channel material, including graphene, MoS2, and WS2 without introducing any additional damage. Through a gate-first technology in which the Al2O3/Al gate stacks are used as a mask for the formation of source and drain, a short-channel HKMG MoS2 transistor with a nearly ideal subthreshold swing (SS) of 61mVdec-1, and HKMG graphene transistor with a cut-off frequency of 150GHz are achieved. Moreover, both graphene and MoS2 HKMG transistor arrays exhibit high uniformity. The study may bring the potential for the massive production of large-scale integrated circuits using 2D materials.
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