Abstract
The growing complexity of integrated circuits (IC) and the rapid development in VHSICs require contactless testing methods for logic state analysis and waveform measurements on internal nodes of VLSI chips. Considering the fast evolution of VLSI/VHSIC technologies, a contactless testing method has simultaneously to provide challenging features like high-voltage resolution (mV), high spatial resolution (sub-micrometer), and high time resolution (ps) in a short testing time. In addition to these requirements, it is desired that the method should be applicable to all technologies, e.g., Si as well as GaAs-based ones.KeywordsEmission PointIntegrate CircuitWaveform MeasurementVLSI ChipPhotoelectron CurrentThese keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.
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