High‐Performance Supramolecular Adhesives

Abstract

AbstractSupramolecular adhesives have gained broad attention from both scientific and industrial aspects by virtue of their dynamic and reversible bonding properties. Although considerable achievements have been made in the exploration of noncovalent interactions for supramolecular adhesives, developing high‐performance supramolecular adhesives has remained a great challenge. Recently, by combining well‐developed noncovalent interactions with rational design strategies, strong and functional supramolecular adhesives have been constructed. From this perspective, the latest developments of high‐performance supramolecular adhesives and their design notions will be discussed. At first, supramolecular adhesives with high bonding strengths are focused. By improving mechanical properties and enhancing interfacial interactions, the adhesion strength of supramolecular adhesive has been increased substantially. Secondly, supramolecular adhesives with various functionalities, such as underwater adhesion and conductivity, are introduced. By removing the hydration layer and incorporating conductive components, underwater and conductive supramolecular adhesives have been fabricated. At last, current challenges and future opportunities in this rapidly developing field will be discussed. It is highly anticipated that this perspective will provide guidance for the construction of supramolecular adhesives with desirable bonding strengths and tailor‐made functionalities.