Abstract
The Printed Electronics (PE) is expected to revolutionise the way electronics will be manufactured in the future. Building on the achievements of the traditional printing industry, and the recent advances in flexible electronics and digital technologies, PE may even substitute the conventional silicon-based electronics if the performance of printed devices and circuits can be at par with silicon-based devices. In this regard, the inorganic semiconducting materials-based approaches have opened new avenues as printed nano (e.g. nanowires (NWs), nanoribbons (NRs) etc.), micro (e.g. microwires (MWs)) and chip (e.g. ultra-thin chips (UTCs)) scale structures from these materials have been shown to have performances at par with silicon-based electronics. This paper reviews the developments related to inorganic semiconducting materials based high-performance large area PE, particularly using the two routes i.e. Contact Printing (CP) and Transfer Printing (TP). The detailed survey of these technologies for large area PE onto various unconventional substrates (e.g. plastic, paper etc.) is presented along with some examples of electronic devices and circuit developed with printed NWs, NRs and UTCs. Finally, we discuss the opportunities offered by PE, and the technical challenges and viable solutions for the integration of inorganic functional materials into large areas, 3D layouts for high throughput, and industrial-scale manufacturing using printing technologies.
Highlights
There is growing interest in developing large-area flexible electronics for applications across numerous sectors, including wearables, robotics, consumer electronics, and healthcare [1–6]
This paper is organized into five sections: In section II, we briefly present the synthesis of nano to chip or macro scale inorganic elements including NWs, NRs, NMs and Ultrathin chips (UTCs)
6 Conclusions Printed electronics (PE) technologies are emerging as a dynamic manufacturing route for large area high-performance electronics
Summary
There is growing interest in developing large-area flexible electronics for applications across numerous sectors, including wearables, robotics, consumer electronics, and healthcare [1–6]. The possible high-performance, at par with siliconbased electronics, with printed inorganic semiconducting materials-based devices has revived the discussion about PE as substitute for the conventional siliconbased electronics [57, 58]. PE leads to less materials wastage, which could help to reduce the electronic waste (e-waste) and potentially allow reuse of some of the electronic materials (e.g. conductive inks) to open new avenues towards circular electronics Considering these developments, it is opportune time to review the latest advances in PE technologies and new opportunities they offer through high-performance devices. Influence the performance of devices and require more attention Considering these factors and the application potential of high-performance PE, this paper provides a thorough review of printing technologies for nano to chip scale inorganic semiconducting structures, mainly in 2D layouts.
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