High-Performance Low-Cost 10-Gb/s Coaxial DFB Laser Module Packaging by Conventional TO-Can Materials and Processes

Abstract

High-performance low-cost 10-Gb/s coaxial DFB laser module packages made by conventional TO-Can materials and processes are developed and fabricated. The laser module has a built-in matching resistor to reduce the resonant phenomenon. In order to optimize the module's performance, a detailed equivalent circuit model is established to investigate both the DFB laser diode and the coaxial package comprehensively. This uncooled 10-Gb/s laser module operates at a high temperature of up to 105degC, and maintains an eye mask margin above 28% in the full operational temperature range to meet the stringent requirements of 10-Gb/s Ethernet for long-reach applications. This paper demonstrates that it is possible to fabricate cost-effective packages using existing low-cost TO-Can package technology while maintaining the high performance of the 10-Gb/s coaxial laser modules. Previously, the high-performance 10-Gb/s coaxial laser modules have only been available by using complicated design, customized components, and specialized fabrication process