Highly thermally conductive composite films by the rational assembly of aramid nanofibers with low-dimensional nanofillers

Abstract

Highly efficient thermal management of electronic devices has grown in significance with the burgeoning of semiconductor technology and 5th generation communication. It is urgently desired to rationally construct highly thermally conductive composite films for enhancing the performance, service life and operation reliability of electronic equipment. Aramid nanofibers (ANFs), as one of the most promising building blocks to fabricate high-performance and multifunctional composite films, have attracted wide attention of researchers over the past few years due to its impressive mechanical performances, excellent electric insulation, and outstanding thermal stability. Especially, the rational assembly of ANFs with low-dimensional thermally conductive nanofillers exhibits significant opportunity for developing highly thermally conductive flexible composite films. However, there is no specialized review to systematically summarize the research advances and prospective challenges of this area until now. Herein, the preparation strategies, structure and properties, as well as the potential applications of various ANFs-based thermally conductive composite films with different low-dimensional nanofillers are highlighted. Finally, possible challenges and opportunities for ANFs-based thermally conductive composite films are envisioned. This brief review delivers the readers an in-depth understanding of the thermal conduction performances of ANFs-based composite films, which may give meaningful enlightenment for designing advanced thermal management materials and ANFs-based functional composites.