Highly thermally conductive BNNS/PANF dielectric composite boards prepared by a facile compression moulding process

Abstract

The structural design of an efficient heat conduction channel is critical for heat dissipation in electronic packaging material. The build of oriented boron nitride nanosheet (BNNS) network inside polymers has attracted much attention due to its excellent thermal conductivity and dielectric properties. However, to fabricate a BNNS/polymer composite, complex method and low thermal conductive resin for binding BNNS network are commonly involved, which severely restrict its facile production and enhancement in thermal conductivity. Herein, by utilizing para-aramid nanofibers (PANF) as assistance to BNNS to form thermal conduction network, we obtained high performance composite boards with good formability and adjustable sizes via a simple compression moulding of the BNNS/PANF aerogels. The composite boards exhibit a remarkable in-plane thermal conductivity of 10.62 W/m K−1 at 50 wt% BNNS loading, outstanding practical thermal management capability, excellent thermal stability, low dielectric constant and loss, showing great potential for electronic packaging applications. This facile construction strategy provides a feasible way for the large-scale production and application of high-performance thermal management materials in the future.