Abstract
We report here a new dual-coating method for the deposition of SiCOH (elementally descriptive but not representing the stoichiometry) ATMS (allyltrimethylsilane) low-k films on mesoporous SiO2 (SBA-15)/PEG (polyethylene glycol) composite films to improve the dielectric constant and mechanical properties of SiCOH/SBA-15 dual forms.
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