Abstract
In this study, a sandwich structure (silicon/polymer/silicon) was prepared to demonstrate the adhesion strength between polymer and silicon layers using a four-point bending system. For the first time, the stealth dicing (SD) method was applied to the silicon layer to generate an initial crack, and the SD method was compared with the traditional method of forming a trench by blade dicing. From the experimental results, the SD method improved the test yield and showed a lower level of sudden force drop. As a result, SD is a highly reliable way to measure the adhesion strength using a four-point bending system.
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