Abstract
Sulfuric acid is a widely used raw material in the chemical industry. Its corrosive effect on materials varies considerably, depending on impurities, temperature and water content. This is an issue for micro process apparatuses with thin walls. Such devices are often joint by diffusion bonding what may alter materials properties due to high temperatures and long dwell times. In this paper, two high molybdenum alloys, namely Hastelloy B3 and BC-1, were investigated. Diffusion bonding tests were performed at different temperatures. Tensile tests were carried out for different material conditions, to determine the change in mechanical strength and elongation at fracture values. The fracture behavior of both alloys was ductile and the fracture surfaces showed dimple structure. For diffusion bonded samples, weak spots or rather non-bonded areas were found. These obviously caused the onset of material failure and thus, degradation of mechanical properties. Tensile samples, aged in 70% sulfuric acid at 100 °C for 1000 h showed local corrosion attacks at the grain boundaries at the circumferential surfaces and joining planes—for Hastelloy B3 more pronounced than for Hastelloy BC-1. Accordingly, a further decrease of stress and elongation at fracture values was observed. However, 0.2% yield strength used for dimensioning components are found to be reasonable. As conclusion, at least Hastelloy BC-1 reveals both good mechanical properties and an excellent corrosion resistance, regardless of the heat treatment. This is a significant advance compared to the results obtained from a previously research project on four different alloys.
Highlights
In addition to blockages caused by by-products resulting from side reactions, corrosion is one of the main reasons for the failure of micro process devices due to the low material thickness
Initial Diffusion Bonding Experiments Made of Ten Sheets
It is observed that the mechanical behavior of Hastelloy BC-1 in tension is comparable to that of Hastelloy B3
Summary
In addition to blockages caused by by-products resulting from side reactions, corrosion is one of the main reasons for the failure of micro process devices due to the low material thickness. Micro process devices are often manufactured from a large number of thin, microstructured sheets, which are mainly joined by diffusion bonding. During processing, they are exposed to high temperatures and long dwell times, which is often associated with a decrease of material strength and formation of precipitations at grain boundaries. Sulfuric acid is widely used in different concentrations in the chemical industry. The strong heat of reactions may occur
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