Abstract
A three-dimensional (3D) MMIC structure with thin polyimide-film layers on wafers significantly increases the integration level of MMICs. We newly developed 9.2-12 GHz receiver and 9.5-14 GHz transmitter chips with 20 dB gain using 3D MMIC technology. The integration levels of these chips are nearly three times as high as those of conventional planar ones.
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