Highly Homogeneous 2D/3D Heterojunction Diodes by Pulsed Laser Deposition of MoS2 on Ion Implantation Doped 4H‐SiC

Abstract

AbstractIn this paper, 2D/3D heterojunction diodes have been fabricated by pulsed laser deposition (PLD) of MoS2 on 4H‐SiC(0001) surfaces with different doping levels, i.e., n− epitaxial doping (≈1016 cm−3) and n+ ion implantation doping (>1019 cm−3). After assessing the excellent thickness uniformity (≈3L‐MoS2) and conformal coverage of the PLD‐grown films by Raman mapping and transmission electron microscopy, the current injection across the heterojunctions is investigated by temperature‐dependent current–voltage characterization of the diodes and by nanoscale current mapping with conductive atomic force microscopy. A wide tunability of the transport properties is shown by the SiC surface doping, with highly rectifying behavior for the MoS2/n− SiC junction and a strongly enhanced current injection for MoS2/n+ SiC one. Thermionic emission is found the dominant mechanism ruling forward current in MoS2/n− SiC diodes, with an effective barrier ΦB = (1.04 ± 0.09) eV. Instead, the significantly lower effective barrier ΦB = (0.31 ± 0.01) eV and a temperature‐dependent ideality factor for MoS2/n+ SiC junctions is explained by thermionic‐field‐emission through the thin depletion region of n+ doped SiC. The scalability of PLD MoS2 deposition and the electronic transport tunability by implantation doping of SiC represents key steps for industrial development of MoS2/SiC devices.