Abstract
Developing advanced EMI shielding materials, possessing robust mechanical properties, and exhibiting efficient thermal conductivity is challenging for contemporary electronic devices. This study involved creating a robust and adaptable polymer composite by combining an EMA (Ethylene Methyl Acrylate Copolymer) polymer matrix with Fe3O4@g-C3N4 (iron oxide decorated on Graphitic carbon nitride) filler utilising a solvent mixing approach. The material showed exceptional electromagnetic interference (EMI) shielding, beneficial thermal conductivity, and mechanical strength. Morphological analysis indicates that the Fe3O4@g-C3N4 particles are evenly dispersed inside the EMA matrix, facilitating a compact spatial network all over the matrix to enable electron hopping. The composites, consisting of Fe3O4@g-C3N4 (15 wt%) conductive filler, demonstrated a notable increase in electrical conductivity, reaching 10−2 S/cm, and an effective EMI SE of −32.4 dB. Additionally, the composite showed a thermal conductivity of 1.3 W.m−1. K−1 and outstanding mechanical strength. The synthesized polymer composite shows great potential for EMI shielding and is well-suited for wearing smart devices.
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