Highly efficient and accurate algorithm for multiscale equivalent modeling and mechanical performance simulation of printed circuit boards

Abstract

The increasing prevalence of reliability issues related to printed circuit boards (PCBs) has led to significant interest in applying finite element analysis (FEA) for PCBs. This study presents an equivalent property algorithm based on the mesoscale finite element method (FEM), which took into account the intricate structural features of conductive layers in PCBs. Additionally, a series of automated scripts were developed to streamline the modeling and calculating process, markedly enhancing the accuracy and efficiency of equivalent modeling and simulation of the PCB. Based on the proposed algorithm, a multiscale three-point bending finite element model of a PCB was established. By comparing the results to experimental data from three-point bending tests, it was demonstrated that the stress field simulated using the proposed algorithm accurately represented the anisotropic properties of the intricate copper traces in the conductive layers, leading to more accurate predictions of mechanical responses than those obtained using conventional algorithms. Furthermore, the research on the impact of partition size on both simulation accuracy and computational efficiency clearly demonstrated that partition size significantly affected these aspects. In conclusion, the proposed algorithm provided a more reliable and efficient approach for applying FEA and FEM to PCBs, contributing to advancements in the field of PCB analysis and fostering improvements in electronics design and manufacturing.