Highly directive package-integrated dipole arrays for low-cost 60-GHz front end modules

Abstract

Package-integrated highly directive dipole antenna and dipole array with an original feeding technique are presented. The proposed design features excitation of low-cost organic-based substrate elevated directive dipoles with vias. A miniature substrate embedded feed network is provided for direct via interconnection between the antenna and a chip embedded in the same stack-up. The simulated single dipole (10 × 10 × 0.635 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sup> ) exhibits more than 11 GHz bandwidth (56 to 67+ GHz), 7.83 dBi peak directivity, and 91.7% efficiency. A prototype of an 8-element dipole array (22 × 11 × 0.635 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sup> ) is measured and exhibits 8 GHz bandwidth (56.6 to 64.6 GHz), 15.1 dBi peak gain at 61 GHz, and 75 to 83% estimated efficiency.