Abstract
AbstractTo develop insulating materials with a high thermally conductive anisotropy, planarly aligned mesogenic epoxy (ME) resin film was fabricated by uniaxial coating on a hydrophobic polyethylene terephthalate substrate. Grazing incidence small‐angle X‐ray scattering (GISAXS) and transmission SAXS measurements exhibited that the films spontaneously formed uniaxially aligned monodomain‐like smectic structures by curing on the hydrophobic substrate. Then, an in‐ and out‐of‐plane thermal conductivity of 10 and 0.048 W m−1 K−1 and outstanding thermal conductivity anisotropy of 208 have been confirmed, respectively. The ME resin films with high thermal conductivity can be applied as insulating materials for multiple‐layer electrical and electronic devices.
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