Highly adhesive metal plating on Zylon® fiber via iodine pretreatment

Abstract

Highly adhesive metal plating was performed on poly(p-phenylene-2,6-benzobisoxazole) fiber named Zylon® via iodine pretreatment followed by electroless plating. First, iodine components were selectively doped into the inner part of the fiber near the surface through iodine vapor exposure. The doped iodine was converted to palladium iodide particles by treating with palladium chloride solution. After the reduction of the iodide to metal palladium particles, electroless copper plating was conducted on the fiber. A uniform copper layer was deposited on the fiber surface and exhibited high durability in durability tests such as ultrasonic exposure, tape peeling-off, and corrosion in NaCl solution. This durability was attributed to the palladium particles formed at the fiber surface that served as an anchor for the plated layer as well as an electroless plating catalyst. The plated fibers also possessed electrical conductivity. Although the tensile strength of the Zylon® fiber decreased from 5.8 to 4.9GPa after undergoing the pretreatment and plating processes, the light shielding effect improved the light resistance of the plated fibers in terms of tensile properties. After 18days of xenon lamp exposure, the plated fibers retained 74% of its initial strength, whereas that of untreated fibers decreased to 43%.