Abstract
The behavior of resistance high-g impact of EMC (epoxy molding compound) with two package models, small outline package (POS) and Globtop, was evaluated by experimental method used Hopkinson bar. At 120,000 g (generated in the Hopkinson bar with widths about 70 μ s) no damage in either the POS devices or the Globtop devices was observed. In order to enhance the EMC’s ability of resistance high-g impact, buffering effect of epoxy resin was also studied. The experimental results above all show that EMC has a better performance of impact resistance at about 120,000 g, and epoxy resin can absorb the stress wave to have the protected ability. The study of this paper could serve as a basis for selection packaging materials and enhance its reliability in high-g impact environment.
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