Abstract
This paper examines multi-field behavior analysis of piezomagnetic microchips panels in a multi-field environment. The displacement field is modeled using the third-order theory for more accurate analysis and satisfying the shear stress condition. The principle of virtual work is employed to obtain the electro-magneto-elastic governing equations of the microchips. The numerical results are obtained to investigate the effect of significant parameters such as micro-scale parameters, electro-magnetic loads, and length to radius ratio. The radial and axial displacements are increased with the increase of micro-scale parameters, while the circumferential displacement is decreased significantly.
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