Abstract
Contrast enhancement by alkaline surface treatment of dyed photoresist is characterized. A surface-modified layer formed by the alkaline surface treatment prevents unexposed areas of the resist from being dissolved and acts as a barrier during development. Utilizing alkaline surface treatment, high-aspect-ratio submicron patterns on a highly reflective substrate are successfully delineated with negligible resist thickness loss. It is found that this modified process is enhanced by baking before exposure.
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