Abstract

Cellulose fiber-based paper has aroused wide interests owing to its potentials in building robust architectures with diverse functionalities. The chemically active surface of cellulose fiber enables the flexible manipulation of interactions, but degrades its mechanical stability in aqueous solution or moisture circumstances. Therefore, a prerequisite of achieving high wet strength is to enhance the anti-swelling capability without limiting the application scenarios. Herein, we proposed a hierarchically split cellulose fiber (HSCF)-based paper with high wet strength, featuring relatively hydrophobic ultrafine polylactic acid (PLA) capping. The reliable interaction between HSCF and PLA is derived from hydrogen bonding, multiple interfaces, and densification by hot-rolling process. The optimal tensile strength and modulus of HSCF/PLA composite paper can reach 100.24 ± 6.38 MPa and 2.50 ± 0.16 GPa, and the high wet strength can achieve 45 MPa. We further showcase the application in circuit board (PCB) with low dielectric constant and loss factor, and high breakdown strength.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.