High-Volume SiC Epitaxial Layer Manufacturing-Maintaining High Materials Quality of Lab Results in Production

Abstract

Typically, research and development (R&D) results of epitaxial layer growth show superior properties of the grown layers compared to high volume results. Layer uniformities are excellent and achieved defect densities are low compared to typical results. In particular, the conversion of basal plane dislocations (BPD) from the silicon carbide (SiC) substrate is in focus to reduce bipolar degradation of p-n-junctions. It is a great challenge to maintain those excellent results in high-volume manufacturing considering all the factors that impact the properties of the epilayer. Thus, quality of the layers, high throughput and low cost have to be assessed to find a compromise between these key factors. In this paper we present results on the growth of epitaxial layers on 150 mm and 200 mm 4° off-oriented 4H-SiC substrates using warm-wall multi-wafer chemical vapor deposition (CVD) systems. Single wafer data of the key epitaxial layer parameters, thickness, doping and defect densities, are compared to batch and lot results, as well as to statistical data of several hundreds of wafers produced. Improvements in wafer-to-wafer (w-t-w) doping uniformity could be achieved for instance by implementation of an on-wafer temperature measurement. Substrate impact on defect levels is shown comparing X-ray topography (XRT) results of bare substrate wafers and defect analysis of epilayers on sister wafers from the same crystal. Statistical defect data and resulting predicted yield loss also show a dependence on substrate suppliers. For the first time we show w-t-w and run-to-run (r-t-r) results of doping and thickness measurements on 200 mm substrates. Also, defect results of epilayers on 200 mm wafers are compared to results on 150 mm.