High Value Thin Wafer Support Technology for 3DIC

Abstract

As the 3DIC market matures, more is understood about the technical and cost challenges [1]. At the 2013 Semicon-West gathering, a panel of global experts identified these technical challenges to represent some of the most significant barriers to the industry's efforts to maintain progress with Moore's Law [2]. Searching and achieving high value manufacturing of 3DIC devices requires wrestling with several technologies and processes, all which may assert a different value for the manufacturer [3]. Current technologies for thin wafer support use a wide range of adhesives applied to the device wafer, bonded to a carrier, backside processed, and de-bonded by an array of methods. Daetec has been investigating temporary bonding for nearly 15yrs, is producing a range of products for semiconductor (e.g. WaferBondTM (Brewer-Science, Inc.)) [4], and for the display market using a low-cost tunable adhesion-force material that is peeled by simple means [5]. Daetec has developed a new technology, DaeBond 3DTM, allowing de-bonding to occur in a batch process while thinned wafers are affixed to film frames. This new approach provides a shift in conventional practice. Our paper presents several temporary bonding options with DaeBond 3DTM in an effort to define value-added approaches for thin wafer handling.