Abstract
A high speed and low-cost electrochemical additive manufacturing method for parallel microprinting of metals is proposed. Multicapillary 3D printed solution flow type microdroplet cells (Sf-MDC) with large capillary diameters (600 μm) are used to electrodeposit high-quality Ni microstructures. Three Ni lines each having a width of around 900 μm and a thickness of around 24.6 μm, 20.7 μm and 15.2 μm are simultaneously printed on Cu substrate. The influence of temperature and scanning speed on the height of printed Ni lines is studied. Independent control of solutions inside each capillary enables the simultaneous formation of Ni-Cu-Ni and Cu-Ni-Cu microdots without any cross-mixing of solutions. By replacing 3D printed inner capillaries (around 600 μm in diameter) with silica capillaries (around 100 μm in diameter) inside the Sf-MDC, free standing 3D structures such as Ni microrods are successfully fabricated. Localized electrodeposition using the Sf-MDC allows parallel process 3D printing of metal microstructures for a wide range of applications.
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