High thermal stability of abrupt SiO2/GaN interface with low interface state density

Abstract

The effects of postdeposition annealing (PDA) on the interface properties of a SiO2/GaN structure formed by remote oxygen plasma-enhanced chemical vapor deposition (RP-CVD) were systematically investigated. X-ray photoelectron spectroscopy clarified that PDA in the temperature range from 600 to 800 °C has almost no effects on the chemical bonding features at the SiO2/GaN interface, and that positive charges exist at the interface, the density of which can be reduced by PDA at 800 °C. The capacitance–voltage (C–V) and current density–SiO2 electric field characteristics of the GaN MOS capacitors also confirmed the reduction in interface state density (Dit) and the improvement in the breakdown property of the SiO2 film after PDA at 800 °C. Consequently, a high thermal stability of the SiO2/GaN structure with a low fixed charge density and a low Dit formed by RP-CVD was demonstrated. This is quite informative for realizing highly robust GaN power devices.