Abstract
AbstractUp to now, low thermally conductive properties and irreversible damage caused by the accidental mechanical failure are still the main negative factors for the wide application of polymer thermal management materials in the microelectronic industry. In this work, we prepared self‐healing polydimethylsiloxane/boron nitride nano sheets (PDMS/BNNSs) composites with high thermal conductivity. PDMS elastomer with the dynamic reversible imine bond acts as the polymer matrix and BNNSs with NH2 in regularly in‐plane arrangement are used as the thermally conductive filler. When the BNNSs filler content is 30 wt%, the thermal conductivity is increased by 588%; The self‐healing efficiency reaches more than 85%, driven by the reversibility of the dynamic imine bond within PDMS; In addition, the tensile strength and the thermal stability exhibit an enhancement of 275% and 31.8°C, respectively, compared to the pure self‐healing PDMS elastomer.
Published Version
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