Abstract
In this paper, high thermal conductive composites are developed for the cooling device of Insulated Gate Bipolar Transistors (IGBT) for aerospace. The composite is fabricated by Spark Plasma Sintering (SPS) from aluminum powder and vapor grown carbon fiber (VGCF). The 10wt% of aluminum-silicon alloy is added to the aluminum powder for the improvement of the interface adherence between VGCF and aluminum. Carbon nanotube (CNT) is also dispersed on VGCF fillers for further improvement of the thermal conductivity of the composite. As a result, the composites fabricated have about three times higher thermal conductivity than the pure aluminum. Especially, a small amount dispersion of CNT into VGCF leads to the large improvement of the thermal conductivity. Analyses of finite element method (FEM) are conducted to understand mechanisms of the improvement of thermal conductivity by the dispersion of CNT. The FEM analysis shows that VGCF-CNT networks play important roles for the improvement of the thermal conductivity.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.