Abstract
During this investigation, a high-temperature, variable melting point (VMP) Sn-Sb solder paste was developed. The solder was created by mixing pure Sn and Sb powders together with a flux to form a paste. The proper choice of flux composition and Sn powder size resulted in a Sn-10wt.%Sb solder paste that had an initial melting point of 232°C and solder ball formation at peak temperatures as low as 241°C. This represents a significant reduction in the process temperature that would normally be required for a prealloyed solder with a melting point of 250°C. When this solder paste is reheated, significant remelting does not take place until a temperature above 241°C is reached. In this way, the solder exhibits a VMP. Experiments indicate that this VMP behavior is due to isothermal solidification (or freezing) at the solder temperature owing to the partial transient liquid-phase (TLP) behavior of the solder powder paste.
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