Abstract
Several electronic applications must withstand elevated temperatures during their lifetime. Materials and packages for use in high temperatures have been designed, but they are often very expensive, have limited compatibility with materials, structures, and processing techniques, and are less readily available than traditional materials. Thus, there is an increasing interest in using low-cost polymer materials in high temperature applications. This paper studies the performance and reliability of sensor structures attached with anisotropically conductive adhesive film (ACF) on two different organic printed circuit board (PCB) materials: FR-4 and Rogers. The test samples were aged at 200 °C and 240 °C and monitored electrically during the test. Material characterization techniques were also used to analyze the behavior of the materials. Rogers PCB was observed to be more stable at high temperatures in spite of degradation observed, especially during the first 120 h of aging. The electrical reliability was very good with Rogers. At 200 °C, the failures occurred after 2000 h of testing, and even at 240 °C the interconnections were functional for 400 h. The study indicates that, even though these ACFs were not designed for use in high temperatures, with stable PCB material they are promising interconnection materials at elevated temperatures, especially at 200 °C. However, the fragility of the structure due to material degradation may cause reliability problems in long-term high temperature exposure.
Highlights
Electronics products are used increasingly in demanding environments, which may cause reliability problems
The stability and degradation of the printed circuit board (PCB) materials were studied with TGA and differential thermal analysis (DTA)
Clear peaks were seen at 1711 cm1, 1638 cm1, 1446 cm1, 1041 cm1, c9m94−1c, m90 ́71,c9m0−71,camnd1,7a8n6dcm78−61.cImt w1a.sItnwotasclneaort cwlehaerthwehrethesrethpeesaekpsewakesrewreerleatreedlateodthtoe tcheeracmeriacmoirc hoyrdhryodcarorbcaornbopnarptaortf othf ethceocmopmopsoitsei.teM. oMstosotf otfhethepepaekasksseseenenininththeennoonn‐a-aggeedd mmaatteerriiaall aallready ddiissaapppeared aafftteerr112200hhoof fagaignigngata2t0200°0C.CV.eVryerlyittlliettclehacnhgaengweaws saesesneaefntearftherist.hTiws. oTnweownsetrwonsgtraonndg wanidewpiedaekps eaatk1s7a0t91c7m09−1 camnd116a0n4dc1m60−14fcomrme1dfoinrmtheed aingetdhesaamgepdlessa.mMpolsetsl.yM, thoestclyh,atnhgeecshsaenegnesinsethene sinamthpelesaamgpedlesata2g4e0d °aCt 2w4e0reCvewryerseimvielrayr tsoimthiloasretosetehnoisne tsheensaimn pthleessaagmedpleast 2a0g0ed°Ca:tt2h0e0chCan: gthese sceheanngocecsusrereendodcucurirnrgedthdeufriirnsgt 1t2h0e hfirasntd12t0hehmanadtetrhiaelsmsaeteemrieadlstsoeebme setdabtolebtehestraebalfetetrh. ereafter
Summary
Electronics products are used increasingly in demanding environments, which may cause reliability problems One such condition is high temperature, which may significantly exceed the typically accepted upper temperature limit of 125 ̋C [1,2]. Metallic or ceramic materials are used in the packaging of high-temperature electronics. This is because of their excellent stability. Metals and ceramics are more expensive and less versatile than polymer materials, and there is an increasing interest in using low-cost polymer materials in high-temperature applications. Long term exposure to temperatures below the thermal limits of a polymer may still degrade the material, making it unreliable
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
